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| Simulation Study of Cutting Temperature and Tool Rake Angle on the Depth of Brittle-Ductile Transition of Monocrystalline Silicon |
| Wu Jiayu1, Ding Yanchun1 , Shi Guangfeng2 , Lv Hailong 1, Mao Li1
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| 1. School of Mechanical and Electrical Engineering, Jilin University of Chemical Technology, Jilin 132022; 2. School of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022 |
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Abstract In the ultra-precision machining of hard and brittle materials, the britt-ductile transition of the material plays a crucial role in its removal. To investigate the effects of cutting temperature and tool rake angle on the brittle-ductile transition process of single-crystal silicon, a two-dimensional orthogonal cutting model of single-crystal silicon was established using ABAQUS simulation software. The influence of temperature and tool rake angle on cutting forces and the brittle-ductile transition process was studied under continuous feed along both the cutting and cutting depth directions. The results indicate that as the cutting temperature increases from 20 °C to 400 °C, both the plastic cutting depth and the brittle-ductile transition depth of single-crystal silicon increase, reaching maximum values of 107.88 nm and 288.57 nm, respectively, while the cutting force decreases. When the tool rake angle decreases from -15° to -60°, both the plastic cutting depth and brittle-ductile transition depth also increase, with maximum values of 99.58 nm and 268.12 nm, respectively, accompanied by a reduction in cutting force. Furthermore, elevated cutting temperatures expand the depth range of the plastic-to-brittle-ductile transition zone, reduce fluctuations in temperature rise deviations, and decrease cutting force oscillations.
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Published: 22 March 2026
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