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吉林化工学院学报, 2025, 42(9): 46-53     https://doi.org/10.16039/j.cnki.cn22-1249.2025.09.009
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切削温度、刀具前角对单晶硅脆塑转变深度的仿真研究
武嘉雨1,丁艳春1,石广丰2,吕海龙1,毛励1
1.吉林化工学院机电工程学院,吉林132022;2.长春理工大学机电工程学院,长春130022
Simulation Study of Cutting Temperature and Tool Rake Angle on the Depth of Brittle-Ductile Transition of Monocrystalline Silicon
Wu Jiayu1, Ding Yanchun1 , Shi Guangfeng2 , Lv Hailong 1, Mao Li
1. School of Mechanical and Electrical Engineering, Jilin University of Chemical Technology, Jilin 132022; 2. School of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022
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摘要 在硬脆材料超精密加工中材料的脆塑性转变对其去除起着至关重要的作用。为探究切削温度和刀具前角对单晶硅脆塑性转变过程的影响,使用ABAQUS仿真软件建立单晶硅二维正交切削模型,从切削、切深方向同时连续型进给的方式研究温度、刀具前角对切削力以及脆塑转变过程的影响。结果表明:当切削温度从20 ℃升高到400 ℃时,单晶硅的塑性切削深度和脆塑转变深度均增大,其最大值分别为107.88和288.57 nm,同时切削力减小;当刀具前角从-15°降低到-60°时,单晶硅的塑性切削深度和脆塑转变深度均增大,其最大值分别为99.58和268.12 nm,且切削力减小。此外,切削温度升高会增大材料的塑性-脆塑转变深度区域,且温升偏差波动逐渐降低,切削力波动减小。
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武嘉雨
丁艳春
石广丰
吕海龙
毛励
关键词:  单晶硅   脆塑转变   有限元仿真   切削温度   刀具前角    
Abstract: In the ultra-precision machining of hard and brittle materials, the britt-ductile transition of the material plays a crucial role in its removal. To investigate the effects of cutting temperature and tool rake angle on the brittle-ductile transition process of single-crystal silicon, a two-dimensional orthogonal cutting model of single-crystal silicon was established using ABAQUS simulation software. The influence of temperature and tool rake angle on cutting forces and the brittle-ductile transition process was studied under continuous feed along both the cutting and cutting depth directions. The results indicate that as the cutting temperature increases from 20 °C to 400 °C, both the plastic cutting depth and the brittle-ductile transition depth of single-crystal silicon increase, reaching maximum values of 107.88 nm and 288.57 nm, respectively, while the cutting force decreases. When the tool rake angle decreases from -15° to -60°, both the plastic cutting depth and brittle-ductile transition depth also increase, with maximum values of 99.58 nm and 268.12 nm, respectively, accompanied by a reduction in cutting force. Furthermore, elevated cutting temperatures expand the depth range of the plastic-to-brittle-ductile transition zone, reduce fluctuations in temperature rise deviations, and decrease cutting force oscillations.
Key words:  monocrystalline silicon    brittle-ductile transition    finite element simulation    cutting temperature    tool rake angle
               出版日期:  2025-09-25      发布日期:  2026-03-22      整期出版日期:  2025-09-25
ZTFLH:  TH701  
引用本文:    
武嘉雨, 丁艳春, 石广丰, 吕海龙, 毛励. 切削温度、刀具前角对单晶硅脆塑转变深度的仿真研究[J]. 吉林化工学院学报, 2025, 42(9): 46-53.
Wu Jiayu, Ding Yanchun , Shi Guangfeng , Lv Hailong , Mao Li. Simulation Study of Cutting Temperature and Tool Rake Angle on the Depth of Brittle-Ductile Transition of Monocrystalline Silicon. Journal of Jilin Institute of Chemical Technology, 2025, 42(9): 46-53.
链接本文:  
https://xuebao.jlict.edu.cn/CN/10.16039/j.cnki.cn22-1249.2025.09.009  或          https://xuebao.jlict.edu.cn/CN/Y2025/V42/I9/46
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